At CeBIT, Enermax has introduced the new ETS-N30 CPU cooler series. Now, the two models, ETS-N30-HE and ETS-N30-TAA, will be available for sale in Europe. For professional system integrators, the compact tower cooler from Enermax is an interesting cooling solution. It is designed for small form factor chassis (mini-ITX or micro-ATX), for multimedia centers as well as for entry-level PCs.
Innovative Air Flow Techniques
The heat sink measures just 92 x 50 x 134mm (W x D x H). But due to Enermax' smart air stream conduction, the cooler achieves an exceptional high performance capability. In the center of the fins, the manufacturer has integrated vents that improve the warm air transfer. While the heat escapes through the openings, fresh air is pulled in by the emerging pressure gradient. Enermax calls this technique "Stack Effect Flow". The patented innovation was applied on the ETS-T40 cooler series for the first time. Another approved solution is the so-called "Vacuum Effect Flow". It is based on the differences in pressure between the heat sink and the ambient air. The side of the cooler is not closed completely, so that cool air can be sucked in. The ETS-N30 comes with one durable 9cm fan. It is equipped with an automatic PWM speed control and allows for a very flexible adjustment of the cooling performance due to its extraordinary wide RPM range (800 – 2,800 RPM). Enermax offers two models, the ETS-N30-TAA with a blue illuminated T.B.Apollish Advance LED fan and the ETS-N30-HE with a simple black 9cm fan.
Intel® Haswell™ Support
The three 6mm heat pipes rest directly on the CPU (patented Heat Pipe Direct Touch Technology), so that the heat can be dissipated quickly and efficiently without additional resistance. Enermax relies on a user-friendly and well-thought installation system which provides the optimal contact force and a secure cooler mounting. Latter fact will be essential for system integrators as it will protect the system from damages during transport. ETS-N30 supports all current CPU platforms from Intel® and AMD® (LGA 775/1150/1155/1156/1366 & AM2/AM2+/AM3/AM3+/FM1/FM2/FM2+) including the new Haswell™ generation.
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